Equipment
Wafer Level Packaging
Chemistry
Equipment
Wafer Level Packaging
Chemistry

Press Releases | News

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SPIE DSS

SPIE DSS

  2014 May 5-9; Booth 871; Baltimore, MD, USA ...

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Nepcon China

Nepcon China

2014 April 23 - 25, Booth: B-1A36 Shanghai World Expo Exhibition & Convention Center www.nepconchina.com/en/

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Newsletter

 

Equipment Manufacturing

Equipment Manufacturing


PacTech is a leading supplier of Advanced Packaging Equipment with more than eighteen years of engineering experience. Our state-of-the-art automated equipment meets high quality standards and is suitable for various applications. Read more

 
Wafer Level Packaging Services

Wafer Level Packaging Services


PacTech is a worldwide leader in Wafer Level Bumping & Packaging Services. These services meet the high quality demands of our customers and support both engineering and prototyping services as well as high volume production. Read more

 
Chemistry

Chemistry


In cooperation with our partners we develop high-tech-chemicals for applications which are adapted to our processes. Our product portfolio includes concentrates and baths ready to use. Read more