Electroless Nickel Plating


PacLine 200/300 (Automated Equipment for Electroless Deposition of NiAu and/or NiPdAu):
 

The – PacLine 300 A50 – is fully automated equipment for electroless deposition of Ni/Au or NiPdAu bumps on semiconductor wafers with Al or Cu pad metallization. The system is able to process carriers with 50 wafers up to 8” and 26 wafers 12”.The PacLine contains of a complete software solution for recipe management, process control and data logging. Complex failure and emergency routines are providing a secure system operation for handling of up to 3 process carrier in parallel. The usage of SECS GEM communication protocol enables direct interfacing with the facility host and flexible final adjustment on customer requirements. Pac Tech is offering standard configured and industry proven bumping line’s as well as customized wet benches. The modular bumping line consists of an input/output station, a customized number of process modules, Quick Dump Rinse tanks, drying station and automatic Ni stripping.
   

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                                 Automatic PacLine 300 A50

                        
                                           PacLine 200 A50
 
                        
                                 Manual PacLine 200 MLC25

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Specifications:

    • 4" - 12" full flexibility
    • UPH: typ. 150 Wafers 8"/hour (5µm Ni/Au UBM) 
    • Thick Au ability for wire bonding reliability 
    • Controller for electroless Ni 
    • Semi conform HMI
    • PLC controlled automatic handling 
    • Additional security tanks for each module
    • SECS GEM Interface
    • QualPac statistic and process control
    • Stainless steel or PVDF frame/housing available
    • Inline drying station
    • The system fulfils the fire safety standard FM 4910


Benefits:

    • Total Quality Software QualPac for ISO 9001
    • Already installed at leading OEM production sites
    • World wide support team located  at 
        Nauen   Germany
        Silicon Valley   USA
        Penang   Malaysia
        Bangkok   Thailand
    • Turnkey process solution
    • Equipment, Process Transfer, Chemistry
    • Maximum Flexibility for 4”- 12” with no tooling
    • Compliant with Semi S2 ; FM 4910 and CE
    • Flexibility in customer specific requirements/adaptations