Solder Jetting & Solder Deballing and Reballing

SB²-Jet (Laser Solder Jetting System):

The SB²-Jet solder balling system is the ideal solution for flexible solder ball placement and laser reflow.
At an average speed of 7 balls  per second, it is  one of the fastest machines on the market today. Different machine platforms are available, from small and midsize semiautomatic machines for prototyping and R&D to high volume (24/7) production machines with various possibilities of different handling systems. The machines provide a reproducible and reliable solder bumping technology for:

Wafers, Optoelectronic Devices, MEMS, Sensors, BGA's, CSP, cLCC's, QFN's, Flip Chips, HDD (HGA, HSA), Camera Modules and many more applications







  • Single-step solder ball placement and laser reflow
  • Fluxfree reflow with laser
  • No special tooling required
  • No additional reflow required
  • Solder ball diameter from 40µm up to 760µm
  • Solder alloy flexibility:
    Eutectic & high-lead SnPb
    Leadfree SnAg, SnAgCu, AuSn, InSn, SnBi
  • In-Line capability, robot cassette to cassette handling
  • High throughput
  • Accurate positioning system
  • Solder Deballing & Reballing capability
  • 2D Ball inspection system












  Solder Ball Jetting                                 



Solder Ball Removal/ Rework