Wafer Level Rework


Ultra-SB² 300 WLR (Wafer Level Solder Ball Rework)
:


Equipment to improve solder ball attach yield to 100%.

   

           Automatic Ultra-SB² 300 WLR

Specifications:

  •  Wafer size: 8" - 12"

  •  Solder ball size: 50µm - 760µm

  •  25 wafers/ hour 12 inch

  •  30 wafers/ hour8 inch

  •  automatic wafer inspection

  •  removal of misplaced balls

  •  flux dispensing

  •  replacement of missing balls

  •  update of electronic wafer map

  •  ultra fast post ball inspection