MEGAPAC MP 300 - Megasonic Clean with QDR and Wafer Handling System:

The Megasonic system MP 300 is e.g. suited for cleaning of flux residues from wafers after wafer level solder paste printing and solder paste reflow.
The system can handle a maximum of one wafer carrier with 25 wafers 8” or 13 wafers 12".

Specifications:

  • Suitable for a Variety of Cleaning Processes:
    e.g.: Solder Flux Cleaning
  • Explosive Safe Construction
  • Semi-Automatic PLC Control
  • Additional QDR Rinse Tank
  • Maximum Flexibility: 4”, 5”, 6”, 8”, 12”
  • Size: 1200 x 800 x 1810 mm (D x W x H)
  • Basin size: 370 x 370 mm
  • AC 400 V, 50 Hz / 25 A / 5 kW
  • Frequency: 1 MHz
  • Heating power: 3 kW
  • Circulation-Filtration: 15 l/min