ASC 200/300:

Automated coating system for wafers up to 12“. The coater is equipped with two hotplates for wafer curing/baking at different temperatures. 
The coating technology provides a very high quality and repeatability of the coating uniformity, especially for wafer backside resist and at the edges of wafers.
The max throughput for the automated system is 50 wafers per hour.

The Spin Coater is available as a semi-automatic system with manual loading or as a fully automated system with cassette to cassette handling.

                 ASC 200