Wafer Level Balling


Ultra-SB² 200/300 (Solder Sphere Transfer System (Gang Ball Placement)):
 




Automatic Ultra-SB² 300
         


            

Semiautomatic Ultra-SB² 200 


      

Specifications:

  •  60µm-760µm solder spheres
  •  150µm-1mm pad pitches
  •  Yield: > 250µm balls: > 99.99 %
  •  Yield: < 200µm balls: > 99.98 %
  •  Solder bump height coplanarity: < 10 µm @ 3sigma
  •  SnPb37 or Lead-free SnAgCu
  •  High throughput: 30 wafers/h 
  •  Wafer sizes: 4 – 12 inch
  •  Robot Handling from cassette to cassette (optional)
  •  Low tooling cost
  •  Volume production & prototyping capability
  •  Integrated rework capability (opt.)
  •  2-D Inspection (optional)