Wafer Level Balling


Ultra-SB² 200/300 (Solder Sphere Transfer System (Gang Ball Placement)):




Automatic Ultra-SB² 300



Semiautomatic Ultra-SB² 200


Specifications:

  • 60µm-760µm solder spheres
  • 150µm-1mm pad pitches
  • Yield: > 250µm balls: > 99.99 %
  • Yield: < 200µm balls: > 99.98 %
  • Solder bump height coplanarity: < 10µm @ 3sigma
  • SnPb37 or Lead-free SnAgCu
  • High throughput: 30 wafers/h
  • Wafer sizes: 4 – 12 inch
  • Supported Wafer Thickness: 6", 8": >=250µm (standard Si wafer, not moldet) / 12": >=450µm (standard Si wafer, not moldet) / 4": <=250µm (on request)
  • Robot Handling from cassette to cassette (optional)
  • Low tooling cost
  • Volume production & prototyping capability
  • Integrated rework capability (opt.)
  • 2-D Inspection (optional)