LAPLACE 200/300 Laser Assembly System:

The LAPLACE provides a solution for BGA’s, Flip Chip attach underfill and reflow on Flex, Substrates  for LCD - Driver, Smart card and smart label applications with a speed of 3000 placements per hour.


[Keine Beschreibung eingegeben]

LAPLACE 300

[Keine Beschreibung eingegeben]
LAPLACE Reel to Reel


Specifications:

  • Flip chip placement & reflow, curing in one step
  • Fluxfree reflow with laser
  • No additional reflow, curing
  • Suitable for Flip Chip Soldering and adhesive Flipchip:
  • ACE, NCP, ICA
  • Substrate materials:
  • PI, PVC, PE, Polyester, paperbased low cost substrates
  • In-Line capability
  • High throughput
  • Available with different accuracy specs [±2,5µm, ±5µm, ±10µm, ±25µm]
  • Vision system
  • Temperature control unit
  • Reel to reel unit (optional)
  • Waferhandling systems (optional)
  • Laser class I (IEC825, E DIN VDE 0750, 871, 837, CDRH)